ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis

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The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.

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Autor/a Assodes & Asmer International
ISBN13 9781627084192
ISBN10 1627084193
Pàgines 461
Any Edició 2022
Fecha de publicación 30/07/2022
Idioma Alemany, Francès

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ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis (Alemany, Francès)

Name: ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
Price: 213.65 EUR
Availability: OutOfStock
Author: assodes & asmer international
ISBN: 9781627084192