Detalls del llibre
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve "short line distances of the cm-mm order" and "large line counts of hundreds-thousands." This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.
This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
- Autor/a Tetsuzo Yoshimura
- ISBN13 9789814877046
- ISBN10 9814877042
- Pàgines 364
- Any Edició 2026
- Fecha de publicación 11/05/2026
Ressenyes i valoracions
Self-organized 3D Integrated Optical Interconnects With All-photolithographic Heterogeneous Integration
- De
- Tetsuzo Yoshimura
- 9789814877046



